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MC10H125 Quad MECL-to-TTL Translator
The MC10H125 is a quad translator for interfacing data and control signals between the MECL section and saturated logic section of digital systems. The 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay, and no increase in power-supply current. Outputs of unused translators will go to low state when their inputs are left open. * Propagation Delay, 2.5 ns Typical * Voltage Compensated * Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) * MECL 10K-Compatible
http://onsemi.com MARKING DIAGRAMS
16 CDIP CASE 620A 1 16 PDIP-16 P SUFFIX CASE 648 1 1 PLCC-20 FN SUFFIX CASE 775 10H125 AWLYYWW MC10H125P AWLYYWW MC10H125L AWLYYWW
16 EIAJ-16 M SUFFIX CASE 966 1 A WL YY WW = Assembly Location = Wafer Lot = Year = Work Week 10H125 ALYW
ORDERING INFORMATION
Device MC10H125L MC10H125P MC10H125FN MC10H125M MC10H125MEL Package CDIP PDIP-16 PLCC-20 EIAJ-16 EIAJ-16 Shipping 25 Units/Rail 25 Units/Rail 46 Units/Rail 50 Units/Rail 2000 Units/Reel
(c) Semiconductor Components Industries, LLC, 2003
1
May, 2003 - Rev. 11
Publication Order Number: MC10H125/D
MC10H125
LOGIC DIAGRAM
2 3 6 7 10 11 14 15 4 VBB Ain Ain 12 Aout Bout Bin Bin VEE
PIN ASSIGNMENT
1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 GND Din Din Dout Cout Cin Cin VCC
5
13 1 VBB* GND = Pin 16 VCC ( +5.0 Vdc) = Pin 9 VEE ( -5.2 Vdc) = Pin 8
*VBB to be used to supply bias to the MC10H125 only and bypassed (when used) with 0.01 mF to 0.1 mF capacitor to ground (0 V). VBB can source < 1.0 mA.
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables.
DIP CONVERSION TABLES
16-Pin DIL to 20-Pin PLCC
16 PIN DIL 20 PIN PLCC 1 2 2 3 3 4 4 5 5 7 6 8 7 9 8 10 9 12 10 13 11 14 12 15 13 17 14 18 15 19 16 20
20-Pin DIL to 20-Pin PLCC
20 PIN DIL 20 PIN PLCC 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 10 10 11 11 12 12 13 13 14 14 15 15 16 16 17 17 18 18 19 19 20 20
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MC10H125
MAXIMUM RATINGS
Symbol VEE VCC VI TA Tstg Power Supply (VCC = 5.0 V) Power Supply (VEE = -5.2 V) Input Voltage (VCC = 5.0 V) Operating Temperature Range Storage Temperature Range - Plastic - Ceramic Characteristic Rating -8.0 to 0 0 to +7.0 0 to VEE 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc Vdc C C C
ELECTRICAL CHARACTERISTICS (VEE = -5.2 V +5%; VCC = 5.0 V + 5.0 %) (Note 2)
0 Symbol IE Characteristic Negative Power Supply Drain Current ICCH ICCL IinH ICBO VOH VOL VIH VIL IOS VBB VCMR Positive Power Supply Drain C D i Current Input Current Input Leakage Current High Output Voltage IOH = -1.0 mA Low Output Voltage IOL = +20 mA High Input Voltage (Note 1) Low Input Voltage (Note 1) Short Circuit Current Reference Voltage Common Mode Range (Note 3) -1.17 -1.95 60 -1.38 -0.84 -1.48 150 -1.27 -1.13 -1.95 60 -1.35 -0.81 -1.48 150 -1.25 -1.07 -1.95 50 -1.31 -0.735 -1.45 150 -1.19 Vdc Vdc mA Vdc V 0.5 0.5 0.5 Vdc 2.5 63 40 225 1.5 2.5 63 40 145 1.0 2.5 63 40 145 1.0 mA mA mA mA Vdc Min Max 44 Min 25 Max 40 Min 75 Max 44 Unit mA
-2.85 to +0.3 Typical
VPP
Input Sensitivity (Note 4)
150
mV
AC PARAMETERS
0 Symbol tpd tr tf Characteristic Propagation Delay Rise Time (Note 5) Fall Time (Note 5) Min 0.8 0.3 0.3 Max 3.3 1.2 1.2 Min 0.85 0.3 0.3 25 Max 3.35 1.2 1.2 Min 0.9 0.3 0.3 75 Max 3.4 1.2 1.2 Unit ns ns ns
1. When VBB is used as the reference voltage. 2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. 3. Differential input not to exceed 1.0 Vdc. 4. 150 mVp- p differential input required to obtain full logic swing on output. 5. Output Voltage = 1.0 V to 2.0 V. RL = 500 W to GND and CL = 25 pF to GND. Refer to Figure 1.
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MC10H125
APPLICATION
TTL RECEIVER
CHARACTERISTIC TEST
*CL includes fixture capacitance
CL *
RL
AC TEST LOAD
GND
Figure 1. TTL Output Loading Used for Device Evaluation
APPLICATION INFORMATION The MC10H125 incorporates differential inputs and Schottky TTL "totem pole" outputs. Differential inputs allow for use as an inverting/non-inverting translator or as a differential line receiver. The VBB reference voltage is available on Pin 1 for use in single-ended input biasing. The outputs of the MC10H125 go to a low-logic level whenever the inputs are left floating, and a high-logic output level is achieved with a minimum input level of 150 mVp- p. An advantage of this device is that MECL-level information can be received, via balanced twisted pair lines, in the TTL equipment. This isolates the MECL-logic from the noisy TTL environment. Power supply requirements are ground, +5.0 volts and -5.2 volts.
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MC10H125
PACKAGE DIMENSIONS
PLCC-20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775-02 ISSUE D
B -NY BRK D -L-MW D Z
0.007 (0.180) U
M
T L-M
M
S
N
S S
0.007 (0.180)
T L-M
N
S
20
1
X V VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R
0.007 (0.180) 0.007 (0.180)
M
T L-M T L-M
S
N N
S
M
S
S
H
0.007 (0.180)
M
T L-M
S
N
S
C
E 0.004 (0.100) G G1 0.010 (0.250) S T L-M J -TSEATING PLANE
K1 K F VIEW S 0.007 (0.180)
M
VIEW S
S
T L-M
S
N
S
N
S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
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MC10H125
CDIP CASE 620A-01 ISSUE O
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620-10. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01
B
16
A
9
A M
B
1 8
L
16X
J
E F
0.25 (0.010)
M
TB
C K T N G
16X
SEATING PLANE
D
0.25 (0.010)
M
TA
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MC10H125
PDIP-16 P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R
-A16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
B
1 8
F S
C
L
-TH G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16.
EIAJ-16 M SUFFIX 16 PIN PLASTIC EIAJ PACKAGE CASE966-01 ISSUE O
16 9
LE Q1 E HE M_ L DETAIL P
1
8
Z D e A VIEW P
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.78 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.031
c
b 0.13 (0.005)
M
A1 0.10 (0.004)
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MC10H125
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MC10H125/D

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